Термо паста Thermaltake TG-50 4G

Характеристики

• Предназначен за:
  Охлаждащи системи
• Х-ка 2:
  TG-50 is a premium thermal compound for high standard cooling performance designed to lower CPU temperatures effectively.
• Х-ка 3:
  With a thermal conductivity of 8.0 W/m-k, the thermal compound also contains diamonds powder allowing users to pursue a higher heat transfer rate.
• Х-ка 4:
  Density: 2.9 g/cm3
• Х-ка 5:
  Viscosity: 47 Pa-s
• Х-ка 6:
  Thermal impedance: 0.035°C -in2/W
• Х-ка 7:
  Thermaltake’s specially formulated thermal compound fits perfectly with the honeycomb stencil, which provides an easier way to apply your thermal compound for a neat and well-covered surface that fits all CPUs.
• Х-ка 8:
  This thermal compound application kit includes a set of easily-applied tools for immediate use.